Flexible PCB
| P/N: Q2E18851A0 | Layer Count: 1L | Min Line W/S: 16/8mil |
| Material: Aluminum | Cu Thickness: 1oz | Min PTH: 0.2mm |
| Board Thickness: 1 .0mm | Surface: OSP | Application:LED |
| Soldermask Color: Yellow | Board Size: 289.00mmX265.00mm(20-up) | |
Product Features
FPC (Flexible Circuit Board) is a type of PCB, also known as a "soft PCB". FPC is made of flexible substrates such as polyimide or polyester film, which has the advantages of high wiring density, light weight, thin thickness, flexibility, and high flexibility.
It is capable of withstanding millions of dynamic bends without damaging wires. FPC freely moves and expand according to spatial layout requirements, achieving three-dimensional assembly, achieving the integration of component assembly and wire connection, with advantages that the other types of circuit boards cannot match.
Option to Choose Flexible Material
Copper foil substrate includes electrolytic copper and rolled copper
A: Electrolytic copper foil substrate: refers to copper foil manufactured by electrolysis method. High ductility electrolytic copper foil: Flexibility higher than standard electrolytic copper foil, can be used together with standard electrolytic copper foil. Disadvantage: prone to cracking during bending, not suitable for dense lines
B: Rollyed copper foil substrate: It is made by repeatedly rolling copper blocks and then high-temperature tempering and toughening them. Its crystalline structure looks like sheet and has excellent softness, making it very suitable for making high-frequency, high-speed, fine and dense circuits. Advantages: Diffidult to Break, good bending resistence and high reliability.
Stack up of FPC
Here is one example of FPC. The structure of HDI combined with flex and rigid part, where resin plug holes and laser drilling in the hard rigid area are required.
Products application
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Cosmic space
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Automotive industry
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Computers
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Consumer Electronics
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Telecommunications
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Medical devices
Industry information
At present, the FPC production process is mainly divided into "sheet to sheet" and "roll to roll". The main raw material for producing FPC, FCCL, is provided in rolls. Under the "sheet to sheet" production process, the rolled FCCL needs to be cut into flakes before subsequent production can proceed, thus the efficiency of this process is relatively low; Under the "roll to roll" production process, the FCCL of the coils can be directly processed and produced. If this process reaches a stable state, it will greatly improve production efficiency and yield.
Overall, compared to developed countries abroad, China's FPC production capacity is still weak. There is still a certain gap in overall technical level compared to developed countries and regions such as Japan, the United States, and Taiwan. With the development of downstream mobile phones, computers, etc. towards miniaturization and lightweight, FPC is also developing towards high-density, ultra fine, and multi-layer directions.
