1. He aha te HDI PCB?
Ko te HDI (Te Tūhono-teitei) ko ngā PCBs he papa arawhiti arā atu anō i hoahoatia hei pupuri i ngā hiko matatini i ngā mokowā kiato. Kāore i te ōrite ki ngā PCBs tūturu, ka whakamahia te hangarau HDI moroiti (ngā puare taraiwa <150μm), whakataki papa pai (whānui raina/mokowā ≤75μm), me whakakotahitanga raupapa kia taea ai ngā āhuatanga wiri nui rawa atu i te 20,000 ngā tūhononga mō ia inihi tapawhā.
Ngā Āhuahira Hanga Matua:
- Ngā Vias Tāraro/Buried: Whakaiti i ngā tauwhiro apa mā te tūhono i ngā apa pātata me te kore e whakakāhore i te papa katoa.
- Thin Dielectrics: Ko ngā rauemi pēnei i Megtron 6, Isola 370HR rānei me Dk ≤3.5 mō te taparenga tohu.
- Via-in-Pad: Ngā wāhi hāngai mā raro i ngā pūpato mōtete hei tiaki mokowā.
Ngā Taupānga:
- Ngā waea atamai (hei tauira, te tāpae HDI 10-layer HDI o iPhone 15).
- Ngā whakatō rongoā (ngā kaihanga me ngā wae rōnaki 0.4mm).
- Ngā pūnaha ADAS waka (ngā kōwae Autopilot a Tesla).
2. He aha ngā mea kua Tāpaetia, kua Tāpaetia, me te Tīpoka Mā i roto i te HDI PCB?
Ngā Vias Tāpae:
Tīaroaro poutū o ngā moroiti puta noa i ngā apa maha.
- Whakamahia te Pū: Te ararere pūmahara DDR5 tere-teitei.
- Tepe: E hiahiatia ana kia auau taiaho pū (±25μm manawanui).
Ngā Vias Tāpae:
Weto i ngā moroiti i waenganui i ngā apa hei whakaiti i te ārohi hau.
- Ngā painga: Ka whakapai ake i te whaikikotanga wera mā te 30% (IPC-6012E).
- Ture Hoahoa: Mokowā mōkito 150μm i waenganui i ngā māka pātata.
Tīpoka Vias:
Ko ngā apa waenga "skip" hei tūhono i ngā apa kāore i te mōhiotia.
- Taupānga: RF ngā kōwae whakamutunga-mua i ngā pou pūtake 5G.
- Mōrearea: Ka nui ake te pūmatuatanga mēnā <100μm te whakawāteatanga ārai-papa.
3. He aha te HDI PCB e tino hiahiatia ana mō ngā Pūrere Whakawhitiwhiti 5G
5G mmWave auau (24–40GHz) tono:
- Ngaronga Tohu Iti: Ko te kapa tōraro iti rawa o HDI (≤0.5μm Ra) e whakamōkito ana i ngā hinganga pānga kiri.
- Mana Impedance: Tight ±5% manawanui mā te whakamahi i ngā rauemi hinu o Toro/FR-4.
- Whakahaeretanga wera: 2W/m·K ngā tohutohu whanonga wera (hei tauira, Arlon 85N) mō ngā tauwhāinga hiko.
Pānga Tūturu o te Ao:
- Ka whakamahia e ngā reo irirangi 5G mMIMO a Erika te 14-layer HDI PCBs kia taea ai ngā huānga pūhihi 64T64R.
- Ko te rahunga ki te whāngai i ngā hua HDI i roto i te 15–20% ngā mokatere raraunga pōturi ake (Qualcomm 2023 pepa mā).
4. He pēhea te whakapai ake a HDI PCB i te tohu tohu i roto i ngā taupānga ōrite-teitei
Arotautanga Hipanga-ki-Hīpanga:
-
Tīpakonga Rauemi:
- Kōwhiria ngā māngere me Df ≤0.002 i te 10GHz (hei tauira, Hotonic Megtron 7).
- Karohia te FR-4 mō ngā auautanga >5GHz.
-
Ngā Rautaki Ararere:
- Whakatinana takirua pārōnaki me te roanga e ōrite ana ≤50μm.
- Whakamahi whakataki whenua mō ngā tohu 28GHz+.
-
Mā te Arotautanga:
- Kāore i whakamahia te taraiwa whakamuri mā te stubs >85% (he mea nui mō pcIe 6.0).
- Hoatu mā te teneti me te kaihoko hai whakaiti i te pūmatuatanga.
Ngā Hua Taea te taea te taea:
- 40% te kōrero whakawhiti iti iho i roto i ngā hononga SerDes 25Gbps.
- 0.5dB te whakaiti i te ngaronga o te kōkuhu i te 28GHz.
5. He aha te AOI (Whakaaronga Ōmata Aunoa) i te Whakanaonga HDI PCB?
Ka whakamahi ngā pūnaha AOI i ngā kāmera 10MP me ngā hātepe AI hei kite i ngā hēnga i ngā papa HDI:
Ngā Piro Whakaaro Takenui:
- Microvia Wall Integrity: Ko ngā whāwhā >10μm kua karaina (mō ia IPC-A-600).
- Tīaroaro Mask Solder: Te manawanui ±35μm.
- Whakataki i te Deviation Whānui: >±15% mai i te hoahoa i ākiritia.
Rerengamahi AOI:
- Karapa Whakahaere-tōmua: Taki ai i te rēhitatanga apa ā-roto.
- Karapa Tāmuri-tuku: E tika ana te tika o te whakataki 75μm.
- Arotakenga Whakamutunga: mahere teitei Ahu-3 mō te coplanarity BGA.
Raraunga Mahi:
- Ka whakaiti te AOI i ngā mokatere maka HDI mai i te 8% ki te <1.2% (Pūrongo Arawhiti Hennan 2024).
- Ko te mokatere waea hē <0.3% me ngā tauira akoranga hōhonu.
