With the development and improvement of printed circuit technology, the development and research of rigid-flex boards have been widely used. It has become an inevitable trend for circuit boards to develop in the direction of being light, thin, short, small, and multi-functional, especially for high-density interconnect structures. The application of (HDI) rigid-flex boards will greatly promote the rapid development of circuit technology, and it is expected that the global supply of rigid-flex boards will increase significantly in the future. At the same time, the durability and flexibility of soft-hard composite boards make them more suitable for medical and military applications, gradually eroding the market share of rigid PCBs.

Although the product is good, the manufacturing threshold is somewhat high. Among all types of PCBs, soft and hard bonding boards have the strongest resistance to harsh application environments, making them favored by medical and military equipment manufacturers. Soft and hard bonding boards combine the durability of rigid PCBs with the adaptability of flexible PCBs. Enterprises in Chinese Mainland are increasing the proportion of such PCBs in the total output to take full advantage of the great opportunity of growing demand. Reducing the assembly size and weight of electronic products, avoiding wiring errors, increasing assembly flexibility, improving reliability, and achieving three-dimensional assembly under different assembly conditions is an inevitable demand for the growing development of electronic products. Flexible circuits, as an interconnection technology with thin, light, and flexible characteristics that can meet three-dimensional assembly needs, have been increasingly widely applied and valued in the electronics and communication industry.